Technical Details
- Series:-
- Package:Bulk
- Part Status:Active
- Type:Solder Paste
- Composition:Bi57Sn42Ag1 (57/42/1)
- Diameter:-
- Melting Point:284°F (140°C)
- Flux Type:No-Clean
- Wire Gauge:-
- Process:Lead Free
- Form:Tube
- Shelf Life:-
- Shelf Life Start:-
- Storage/Refrigeration Temperature:-
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