Technical Details
- Series:268
- Package:Bulk
- Part Status:Active
- Type:Wire Solder
- Composition:Sn96.5Ag3Cu0.5 (96.5/3/0.5)
- Diameter:0.020" (0.51mm)
- Melting Point:423 ~ 424°F (217 ~ 218°C)
- Flux Type:No-Clean
- Wire Gauge:24 AWG, 25 SWG
- Process:Lead Free
- Form:Spool, 17.64 oz (500g)
- Shelf Life:-
- Shelf Life Start:-
- Storage/Refrigeration Temperature:50°F ~ 104°F (10°C ~ 40°C)
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