Technical Details
- Series:NXG1
- Package:Bulk
- Part Status:Active
- Type:Solder Paste
- Composition:Sn99.3Cu0.7 (99.3/0.7)
- Diameter:-
- Melting Point:441°F (227°C)
- Flux Type:No-Clean
- Wire Gauge:-
- Process:Lead Free
- Form:Jar, 17.64 oz (500g)
- Shelf Life:8 Months
- Shelf Life Start:Date of Manufacture
- Storage/Refrigeration Temperature:32°F ~ 50°F (0°C ~ 10°C)
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