Technical Details
- Series:R500
- Package:Bulk
- Part Status:Active
- Type:Solder Paste
- Composition:Sn96.5Ag3.0Cu0.5 (96.5/3.0/0.5)
- Diameter:-
- Melting Point:423 ~ 424°F (217 ~ 218°C)
- Flux Type:Water Soluble
- Wire Gauge:-
- Process:Lead Free
- Form:Syringe, 1.23 oz (35g), 10cc
- Shelf Life:6 Months
- Shelf Life Start:Date of Manufacture
- Storage/Refrigeration Temperature:32°F ~ 50°F (0°C ~ 10°C)
Related Products
THERMALLY STABLE SOLDER PASTE NO
In Stock: 2
- 1: $97.50000
SOLDER WIRE 62/36/2 TIN/LEAD/SIL
In Stock: 19
- 1: $10.98000
LF SOLDER WIRE 99.3/0.7 TIN/COPP
In Stock: 35
- 1: $20.29000
SOLDER PASTE 63/37 T5 500G
In Stock: 3,598
- 1: $180.75000
SOLDER FLUX-CORED/44 .015" 1LB S
In Stock: 2,517
- 1: $249.06000
- 25: $245.68292
SOLDER SPHERES SN63/PB37 .022" (
In Stock: 2
- 1: $83.95000
SOLDER LEAD-FREE 0.8MM 100G
In Stock: 6
- 1: $48.31000
LEAD FREE NO-CLEAN FLUX CORE SIL
In Stock: 3,795
- 1: $58.00000
LF SOLDER WIRE 96.5/3/0.5 TIN/SI
In Stock: 23
- 1: $35.34000
SOLDER NO-CLEAN 60/40 1/2 LB
In Stock: 9
- 1: $31.35000
- 5: $30.70703
- 10: $28.14812
Added to cart!
This item has been added to your cart.