Technical Details
- Series:R231
- Package:Bulk
- Part Status:Active
- Type:Solder Paste
- Composition:Sn63Pb37 (63/37)
- Diameter:-
- Melting Point:361°F (183°C)
- Flux Type:Rosin Mildly Activated (RMA)
- Wire Gauge:-
- Process:Leaded
- Form:Jar, 17.64 oz (500g)
- Shelf Life:4 Months
- Shelf Life Start:Date of Manufacture
- Storage/Refrigeration Temperature:32°F ~ 50°F (0°C ~ 10°C)
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